G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G104-1122 - Current Bare glass substrates which can

Bare glass substrates which can be used as facing substrates and color filter substrates

SEMI PV58-1021 (technical revision)

000 defects per cm2

This Guide describes methods for reporting energy

G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G104-1122 - Current Bare glass substrates which canMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular, and sheet material are used for WLP and PLP and these materials require the different characteristics and performances. The