P02700 - SEMI P27 - Parameter Checklist for Resist Thickness Measurement on a Substrate StdTpc-Equipment Process Control on demand requests for data

on demand requests for data from the equipment

향후 반도체 공장은 더 무거워진FOUP및 오픈 카세트(open cassettes)를 포함하는 웨이퍼 캐리어(carrier)를 전송하기 위해서 대규모의 자동화된 재료 처리 시스템(AMHS)을 사용할 것이다

This specification is part of the SEMI Sensor/Actuator Network (SAN) suite of standards and defines a specific communications protocol based on the PROFINET standard

This Practice is limited to an optical microscope with an illumination system that is an integral part of the microscope body and includes a condenser lens

P02700 - SEMI P27 - Parameter Checklist for Resist Thickness Measurement on a Substrate StdTpc-Equipment Process Control on demand requests for dataThis checklist was technically approved by the Global Micropatterning Committee and is the direct responsibility of the Japanese Micropatterning Committee. Current edition approved by the Japanese Regional Standards Committee on April 28, 2003. Initially available at www. semi. org June 2003; to be published July 2003. Originally published in 1996. NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain