Pay in 4 interest-free payments of $48.25 Learn more
Ships within 48 hours · Estimated delivery Jul 27 - Aug 1
originally published in 1993
2 This Guide describes wafers and wafer stacks with nominal diameter of 300 mm and nominal thickness of 775 µm
This Document applies to the shelf life of properly packaged
SEMI C29-0618 (technical revision)
C09600 - SEMI C96 - Test Method for Determining Density of Chemical Mechanical Planarization (CMP) Slurries StdTier-Tier1 originally published in 1993The purpose of this Test Method is to provide a standardized test method for measuring the density of slurries, defining the sample temperature for the density measurement and specifying the number of significant figures to which the resulting measurement should be measured by the user and reported in the corresponding Certificate of Analysis (CoA) from the supplier. This Test Method describes the conditions and procedures for measuring the density of
US$ 87.50
US$ 29.00
US$ 16.25
US$ 12.00
US$ 10.00
US$ 16.25
US$ 19.95
US$ 43.00
US$ 11.50
US$ 15.60