Pay in 4 interest-free payments of $48.25 Learn more
Ships within 48 hours · Estimated delivery Jul 30 - Aug 4
本文件涵盖了局部萃取法和全浸泡法微量金属采集技术。
Initially available on SEMI OnLine August 1999
This Document is intended to help the semiconductor equipment supplier design equipment exhaust ventilation systems to a common set of performance criteria as well as to provide assistance to both users and suppliers in the understanding of exhaust ventilation requirements for equipment systems
non-transition metal species have been included as n-type dopants
G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G103-1122 - Current 本文件涵盖了局部萃取法和全浸泡法微量金属采集技术。Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of
US$ 599.50
US$ 42.00
US$ 42.00
US$ 42.00
US$ 105.00